驍龍778G

高通公司於2021年5月18日推出了基於6納米工藝技術的驍龍778G 5G移動平台，擴展其7系列產品組合。

驍龍778G支持三ISP，可同時拍攝三張照片或三個視頻，包括廣角、超廣角和變焦。用户可以同時通過三個鏡頭進行視頻錄製，不僅每個鏡頭可以捕捉最佳效果，還能自動將三個畫面合成為一支專業品質的視頻。用户還可以如專業攝影師一般拍攝4K HDR10+視頻，捕捉超過10億色。驍龍778G還支持單幀逐行HDR圖像傳感器，從而用户可以利用計算HDR賦能的視頻拍攝，獲得色彩、對比度和畫面細節方面的顯著提升。

驍龍778G支持全新的第六代高通AI引擎包括高通Hexagon™ 770處理器，可帶來高達12TOPS的算力，性能較前代平台實現翻番，且每瓦特性能得到提升。AI為幾乎所有的連接體驗、視頻通話和語音通話提供加持，比如基於AI的噪音抑制、更出色的基於AI的影像用例等。第二代高通傳感器中樞集成的專用低功耗AI處理器能夠支持情境感知用例，進一步增強了該平台的性能。

該平台支持部分高通Snapdragon Elite Gaming™特性，包括可變分辨率渲染（VRS）和高通Game Quick Touch，這兩項特性已在驍龍7系平台中實現支持。憑藉高通Adreno™ 642L GPU，VRS讓開發者能夠在不同的遊戲場景中指定和分組被着色的像素，以減少GPU的工作負載，從而在保持畫面最高的視覺逼真度的同時降低功耗。高通Game Quick Touch將觸控響應速度提升20%，降低觸控時延的同時，帶來專業級遊戲體驗。

驍龍778G集成驍龍X53 5G調制解調器及射頻系統，可為全球更多用户帶來毫米波和Sub-6GHz頻段5G連接能力。通過高通FastConnect™ 6700移動連接系統，驍龍778G支持數千兆比特級的Wi-Fi 6速度（高達2.9Gbps）和4K QAM，並在5GHz和6GHz頻段支持160MHz信道。此外，由高通技術公司認證的高通Snapdragon Sound™技術套件採用先進的音頻特性及系統級優化，可實現全新的端到端聆聽體驗。憑藉藍牙5.2、極速的Wi-Fi 6/6E和5G連接，驍龍778G能夠為遊戲、分享和視頻通話等場景帶來低時延表現。

驍龍778G採用先進的6納米工藝製程，能夠提供出色的性能和能效。高通Kryo™ 670 CPU整體性能提升高達40%。Adreno 642L GPU的圖形渲染速度較前代平台提升高達40%。

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GPU Name: Qualcomm® Adreno™ 642L

CPU Name: Qualcomm® Kryo™ 670

Qualcomm® Hexagon™ Processor Name: Qualcomm® Hexagon™ 770

Qualcomm® Hexagon™ Processor Features: Qualcomm® Hexagon™ Tensor Accelerator, Qualcomm® Hexagon™ Voice Assistant Accelerator, Large shared AI memory, Qualcomm® Hexagon™ Scalar Accelerator, Qualcomm® Hexagon™ Vector eXtensions (HVX)

Qualcomm® Sensing Hub Generation: 2nd, 2nd

Qualcomm® Sensing Hub Features: Qualcomm® Sensing Hub, Qualcomm® Sensing Hub

Location Support: Qualcomm® Location Suite, Sensor-assisted Positioning

Satellite Systems: GLONASS, NavIC, Beidou, GPS, QZSS, Galileo

Frequency Support: Dual (L1/L5)

Accuracy: Lane-level, Sidewalk-level

Near Field Communications: Supported

Name: Qualcomm® Kryo™ 670

Architecture: 64-bit

Clock Speed: Up to 2.4 GHz

Name: Qualcomm® Adreno™ 642L

APIs: OpenGL® ES 3.2, OpenCL™ 2.0 FP, Vulkan® 1.1

Modem Name: Snapdragon® X53 5G Modem-RF System

Peak Download Speed: Up to 3.7 Gbps

Peak Upload Speed: Up to 1.6 Gbps

Cellular Modem-RF Specs: 100 MHz bandwidth (sub-6 GHz), 400 MHz bandwidth (mmWave)

Performance Enhancement Technologies: Qualcomm® AI-Enhanced Signal Boost adaptive antenna tuning, Qualcomm® Wideband Envelope Tracking, Qualcomm® Smart Transmit™ technology, Qualcomm® 5G PowerSave

Cellular Technology: 5G NR, HSPA, sub-6 GHz, Dynamic Spectrum Sharing (DSS), CDMA 1x, EV-DO, LTE support for CBRS, LTE, GSM/EDGE, WCDMA, mmWave

Multi SIM: Global 5G Multi-SIM

Wi-Fi/Bluetooth System: Qualcomm® FastConnect™ 6700

Peak Speed: Up to 2.9 Gbps

Generation: Wi-Fi 6E, Wi-Fi 4, Wi-Fi 6, Wi-Fi 5

Standards: 802.11a, 802.11b, 802.11g, 802.11n, 802.11ax

Spectral Bands: 6 GHz, 2.4 GHz, 5 GHz

Channels: 160 MHz

Peak QAM: 4K QAM

Security: WPA3

Features: OFDMA (UL/DL)

Wi-Fi/Bluetooth System: Qualcomm® FastConnect™ 6700

Specification Version: Bluetooth® 5.2

Topologies: Bluetooth® Low Energy Audio One-To-Many Broadcast

Features: Dual Bluetooth® Antennas

Image Signal Processor (ISP) Name: Qualcomm® Spectra™ 570L

Image Signal Processor (ISP) Type: Image Signal Processor (ISP)

Image Signal Processor (ISP) Number: Triple ISP

Image Signal Processor (ISP) Bit Depth: 14-bit

Color Depth: Up to 10-bit

Single Camera (MFNR, ZSL, 30 fps): Up to 64 MP

Single Camera: Up to 200 MP

Features: AI-based auto-exposure, AI-based auto-focus, High Dynamic Range (HDR), Multi-frame Noise Reduction (MFNR), High Efficiency Image File Format (HEIF), High-Efficiency Image Container (HEIC)

Slow Motion Video Capture: Up to 720p @ 240 fps

Video Capture Color Depth: Up to 10-bit

Video Capture Color Gamut: Rec. 2020

Video Capture Formats: Hybrid Log Gamma (HLG), HDR10, HDR10+

Video Capture Features: Staggered High Dynamic Range (HDR) sensor

Codecs: Hybrid Log Gamma (HLG), HDR10+, H.264 (Advanced Video Coding (AVC)), VP9, VP8, H.265 (High Efficiency Video Coding (HEVC)), HDR10

Maximum On-Device Display Resolution: FHD+ @ 144 Hz

Maximum External Display Resolution: 4K @ 60 Hz

High Dynamic Range (HDR): HDR10+, HDR10

Color Depth: Up to 10-bit

Color Gamut: Rec. 2020

Qualcomm Aqstic™ technology support: Qualcomm Aqstic™ smart speaker amplifier up to Qualcomm® WSA8835, Qualcomm Aqstic™ audio technology, Qualcomm Aqstic™ audio codec up to Qualcomm® WCD9385

Qualcomm® aptX™ audio technology support: Qualcomm® aptX™ suite, Qualcomm® aptX™ Adaptive

Qualcomm® Quick Charge™ technology support: Qualcomm® Quick Charge™ 4+ technology

Fingerprint Sensor: Qualcomm® 3D Sonic Sensor

Features: Qualcomm® Type-1 Hypervisor, Platform Security Foundations

Speed: 3200 MHz

Type: LPDDR5

Supported Interfaces: USB-C, USB 3.1

Interface Type: USB-C

Specification Version: USB 3.1

Process Node: 6 nm

Part Number(s): SM7325

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2021年6月16日19時30分，榮耀召開榮耀50系列發佈會，會上發佈了榮耀50系列產品。榮耀50系列搭載高通驍龍778G 5G芯片，相比上一代，不但提升了CPU、GPU的運算能力，還提升ISP，對於Vlog拍攝有所幫助。 ^[2]