楊亮

楊亮，自2008年以來，一直從事功能材料、LED封裝材料的製備、表徵及封裝工藝研究。近年來參與國家自然科學基金、湖北省自然科學基金、02重大專項等課題；在國內外著名刊物上發表論文十餘篇，其中SCI收錄4篇，EI收錄6篇，申請國家發明專利2項。 ^[1] 

[1]　 LED封裝材料和封裝工藝的研究；

[2]　 先進熒光粉塗覆技術研究；

[3]　 LED熒光粉的製備、表徵及其封裝測試。 ^[1] 

[1] 湖北省自然科學基金：基於圓片鍵合的直接白光LED芯片技術研究(批准號：2011CHB009)；2012.1-2013.12，參與。

[2] 國家自然科學基金項目：大功率LED製造關鍵科學技術；2009.01-2013.12，參與。 ^[1] 

[1]LiangYang,MingxiangChen,ZhichengLv,SiminWang,XiaogangLiu,ShengLiu.PreparationofaYAG:Cephosphorglassbyscreen printingtechnologyanditsapplicationinLED.OpticsLetters,2013,38(13):2240-2243. (SCI)

[2]LiangYang,SiminWang,ZhichengLv,ShengLiu.Colordeviation controllingofphosphorconformalcoatingbyadvancedspraypainting technologyforwhiteLEDs.AppliedOptics,2013,52(10):2075-2079. (SCI)

[3]LiangYang,ZhichengLv,YuanJiaojiao,ShengLiu.EffectsofMF resinandCaCO₃diffuserloadedencapsulationonCCTuniformity of the phosphorconvertedLEDs.AppliedOptics,2013. (SCI)

[4]LiangYang,MingxiangChen,ShengLiu.FabricationofGelGlassContainingHighRenderingPhosphorMixtureviaSol-GelProcessforLEDs.IEEEProc.OfECTC,2013,2371-2374.

[5]LiangYang,ZhichengLv,MingxiangChen,ShengLiu.CombinationofTranslucentEu:YAGGlassCeramicwithLEDchip.IEEEProc.OfECTC, 2012,2145-2149.

[6]LiangYang,MingxiangChen,ShanYu,ZhichengLv,ShengLiu.FabricationofYAGGlassCeramicandItsApplicationforLightEmitting Diodes. IEEEProc. of ICEPT-HDP,2012,1463-1466.

[7] LiangYang, MingxiangChen,Shengjun Zhou, ShengLiu. Preparation of Phosphor Glass via Screen Printing Technology and Packaged Performance for LEDs. IEEEProc.ofICEPT-HDP,2012, 1189 - 1192.

[8] Zhicheng Lv, Liang Yang, Jiaojiao Yuan, Jing Fang, Bin Cao, Sheng Liu, Study on Packaging Method Using Silicon Substrate with Cavity and TSV for Light Emitting Diodes, IEEE Transactions on Components, Packaging and Manufacturing Technology. (SCI)

[9] Yu Shan, Yang Liang, Cao Bin, Zheng Huai, Cheng Mingxiang, Liu Sheng. Development Process of Phosphor Coating with Screen Printing for White Light Emitting Diode Packaging. IEEE Proc. Of ICEPT-HDP, 2011, 1-5. ^[1]